
September 8 marked the final day of IFA 2026 in Berlin, Germany. As one of the world’s three premier consumer electronics trade shows, this year’s IFA—held from September 4—drew over 1,900 exhibitors from 49 countries and regions, with an expected attendance of more than 220,000 visitors worldwide. LeiTech (ID: LeiTech) deployed its “LeiTech IFA26 Reporting Team” to Berlin for on-the-ground, multi-dimensional, and first-hand coverage of the event.
Against the backdrop of continuously rising memory and flash storage prices, storage manufacturers have garnered increasing attention. At this year’s IFA, Lexar unveiled multiple new products, among which the all-new Lexar Muse portable SSD immediately captured spotlight upon debut—earning six major awards from leading global media outlets.
The Lexar Muse stands out for its extreme thinness: its thickest point measures just 3.8 mm, while its edge thickness is only 1 mm. Equipped with N52-grade magnets, the drive securely attaches to the back of smartphones with minimal impact on tactile feel.

(Photograph source: LeiTech IFA Reporting Team, on-site capture)
Featuring a proprietary Pogo-Pin magnetic data interface and a custom magnetic data cable, the Lexar Muse achieves automatic alignment and connection simply by bringing it close to the port. With peak read speeds of up to 1,050 MB/s and write speeds of up to 1,000 MB/s—alongside native compatibility with 4K Apple ProRes video recording on iPhone models—the Lexar Muse is ideal for professional video capture and editing workflows.
In the portable SSD category, achieving greater thinness is never trivial. According to Lexar’s on-site IFA representative speaking with LeiTech, developing this drive posed three primary engineering challenges: first, ensuring stability and reliability; second, managing thermal dissipation; and third, designing a robust physical connection.
It’s important to note that portable SSDs may be subject to accidental drops—making uncompromising quality assurance essential. During operation, these drives generate heat; inadequate thermal management will inevitably degrade read/write performance. Moreover, at its thinnest point, the Lexar Muse is even thinner than a standard USB-C connector—posing significant design hurdles for reliable cable connectivity.

(Photograph source: LeiTech IFA Reporting Team, on-site capture)
Lexar’s booth staff explained to LeiTech that these challenges were addressed through specialized materials, unique CMF (Color-Material-Finishing) processes, and custom-designed cables. For the enclosure, Lexar employed Unibody CNC machining to deliver an impeccable, card-like tactile experience—and simultaneously enhance structural reliability.
According to Lexar booth staff, this is the industry’s first-ever card-form-factor portable SSD—not only unprecedentedly thin but also entirely novel in form factor, compact enough to fit inside a hotel room key card sleeve.
With soaring NAND flash chip prices, price gaps between different storage capacities in flagship devices have widened dramatically. For instance, on Apple’s official Chinese website, the price difference between the 256 GB and 512 GB variants of the iPhone 17 Pro currently stands at RMB 2,000. Following the launch of the Lexar Muse, consumers may consider foregoing higher-capacity versions of the iPhone 17 series—or upcoming iPhone 18 models—in favor of expanding iPhone storage affordably via the Lexar Muse, thereby reducing their overall iPhone purchase cost.
Lexar staff also revealed that the Lexar Muse is expected to open for pre-order in October, with official availability scheduled for November. LeiTech will conduct a comprehensive hands-on review of this portable SSD as soon as it launches.

(Photograph source: LeiTech IFA Reporting Team, on-site capture)
At IFA 2026, Lexar also showcased several innovative storage solutions: responding to the growing local AI large-model demand for high-capacity storage, Lexar presented the latest developments in its AI-grade Gen5 SSD and AI-grade Gen5 Storage Stick. New advancements in AI Storage Core technology—as well as automotive-grade USB drives—were also on display.
Beyond the consumer market, Lexar is actively expanding into commercial applications, targeting OEM partnerships, commercial PCs, and professional-use scenarios. For system integrators and enterprise customers, Lexar exhibited a full portfolio of PCIe solutions spanning PCIe 3.0, PCIe 4.0, and PCIe 5.0 standards.
LeiTech believes Lexar is now at a pivotal juncture—transitioning from a consumer storage brand to a comprehensive, full-scenario storage solutions provider. In the consumer (C-end) market, Lexar will steadily advance based on its current product lineup; in the business (B-end) market, Lexar aims to cultivate its second growth engine through commercial OEM partnerships, automotive storage, and enterprise-grade solutions. In 2024, Lexar was named among the “Top 30 Global Chinese Brands” by Forbes China’s “Global Expansion Leaders” list. Backed by Longsys’ end-to-end supply chain and technical support, Lexar is poised to maintain its leadership position among Chinese brands going global.
From September 4–8, the world’s largest consumer electronics and home appliance exhibition—IFA 2026—took place in Berlin.
As the “most authoritative new media outlet covering IFA” widely recognized by the global AI community, LeiTech dispatched its largest and highest-caliber reporting team ever to Berlin this year. Deploying a “2+N” model—featuring two live hosts plus multiple on-site editors and backend editors—LeiTech delivered real-time, multi-dimensional, and first-hand coverage of IFA 2026. Key coverage themes included AI agents integrated with home appliances and hardware, robotics technologies converging with domestic living environments, emerging digital lifestyle trends across human-device-vehicle-home ecosystems, and Chinese brands’ global presence.
LeiTech’s IFA 2026 Reporting Team is currently conducting intensive on-site coverage in Berlin—stay tuned!



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